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【Closed】Tech Innovation Excellence Award (TIE Award): The Call for Applications is now open!

 

📢The TIE Award 2023 is now open for registration until May 31! We invite all startups from around the world to join us!

🏆The winners will receive various award benefits, including cash prizes, partial subsidies for business trips and opportunities to partner with Taiwanese semiconductor companies, national-level research institutes. 

 

✴️Registration for 2023 TIE Award👉https://reurl.cc/XLkjpM

✴️Registration for Online Briefing Sessions👉https://forms.gle/hSMpJ9YSyyPKwmuG7

 

 

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Last Modified : 2024/04/26