🧩Built in Taiwan. Scale worldwide. IC Taiwan Grand Challenge🧩
Following IC Taiwan Grand Challenge’s recent Silicon Valley engagement, global founders and researchers are increasingly turning to Taiwan to prototype, scale, and commercialize next-generation semiconductor and AI technologies.
⏳Time is running out! ICTGC Batch 4 applications close on February 28, 2026.
Start your application today! Save your progress and submit before Feb 28th: ictaiwanchallenge.org
🔎Why apply to the IC Taiwan Grand Challenge?
• USD 30,000 cash prize
• Mentorship, manufacturing access, and corporate partnerships
• Opportunity to showcase at COMPUTEX & InnoVEX 2026 in Taipei
Startups, research teams, and innovators in AI, chips, and deep tech are invited to apply.
🧑🔬Who can apply?
Startups (under 8 years), researchers, and innovators in:
🔹 AI Core technologies & Chips, including applications in AI chip design, Hardware acceleration, and Cybersecurity, etc.
🔹 Smart Mobility, including applications in Communications/Satellite and Electric Vehicles, etc.
🔹 Smart Manufacturing, including applications in IC Process, Robotics, and Intelligent Manufacturing, etc.
🔹 Smart Medtech, including applications in Biometrics, Smart Monitoring, and e-Health, etc.
🔹 Sustainability, including applications in Sustainable Manufacturing, Energy Saving Innovation, and New Energy, etc.
