To promote the exploratory research on the advanced semiconductor devices, materials, and process monitoring techniques, the program aims for innovative “out-of-box” solutions that could maintain the leading position of Taiwan in the semiconductor industry for the next decade.     

In Sub-Program 1, Advanced Semiconductor Equipment: Material analysis technologies for Å-scale semiconductors, we leverage the cutting-edge analysis techniques in academia that satisfy the needs for the increasing complexity of advanced semiconductor manufacturing process with the Å-scale resolution.  

In Sub-Program 2, Key Materials: Semiconductor devices and materials for challenging the ultimate physical scaling limit, we form multidisciplinary research teams to develop next-generation semiconductor technologies based on low-dimensional materials and devices for extending physical scaling limit.

In Sub-Program 3, Angstrom Semiconductor Technology: Exploring key sub-nanometer scale semiconductor devices and circuits, following the DARPA Grand Challenge approach with the sufficient seed fund from government investment, we intend to explore feasible technology paths toward equivalent 1nm-node devices and circuits that satisfy the needs of semiconductor industry for the next decade. 

In Sub-Program 4, Angstrom Semiconductor Technology: silicon-based quantum computer sub-system development, to realize the first quantum computer in Taiwan, 3 sub-systems with different functions will be developed and integrated to demonstrate the functionality of quantum computing.

Semiconductor industry is the economics and safety cornerstone of Taiwan. However, we face several grand challenges. Not only other countries strive to nurture their own domestic industries, but also the semiconductor technologies are approaching the fundamental physical limits rapidly. The program expects to develop breakthrough solutions for the key challenges of beyond 1nm semiconductor technology that will be in mass production in 2030.