Sep. 17, 2026
The National Science and Technology Council (NSTC) of Taiwan and the German Federal Ministry for Research, Technology and Space (BMFTR) have jointly hosted the "2026 Taiwan–Germany (NSTC–BMFTR) Semiconductor Forum" from September 15 to 17, 2026, in Munich, Germany. The event showcases recent collaborative milestones and blueprints the next phase of collaboration on semiconductor chip design and advanced packaging, further deepening the strategic partnership between Taiwan and Germany in semiconductor technology and industrial innovation.
Dr. Y.-W. Peter Hong, Director General of the Department of Engineering and Technologies at NSTC, noted that the partnership between NSTC and BMFTR first started in 2017, when they launched the joint research initiative on battery technology. The successful exchange paved the way for the signing of the bilateral Science and Technology Arrangement (STA) in 2023, under which a joint semiconductor research initiative was launched in 2024. To date, 23 joint projects have been awarded. By combining the complementary R&D capabilities of both sides, these projects ex-plored key technologies and solutions in advanced chip design, heterogeneous inte-gration, and emerging applications. Furthermore, participating research teams are strongly encouraged to pursuit on-site research stays abroad, strengthening the international collaboration platform while enhancing the global visibility and real-world impact of their joint outcomes.
Representing the BMFTR, Dr. Fabian Kohler emphasized that, in the current geopolitical climate, the Taiwan-Germany semiconductor partnership is vital for build-ing a robust chip design talent pipeline and enhancing global market resilience. Both sides are exchanging knowledge on the world’s most cutting-edge technologies and translating these outcomes into local value creation, while simultaneously boosting innovation capabilities to jointly address technological and societal challenges. The BMFTR remains committed to long-term cooperation with Taiwan, continuing to strengthen the technological cooperation framework with plans to advance the microelectronics research partnership to its next stage.
Held at the Technical University of Munich (TUM), the 2026 Semiconductor Forum brings together principal investigators and core research team members funded across three calls (2024–2026). The research topics focus on edge-AI chips, wireless communications, design automation, advanced packaging, and quantum computing. In addition to project presentations and interactive poster sessions, BMFTR also ar-ranged introductions or on-site visits to prominent academic institutions and leading industry partners. These include research centers located on the TUM campus—such as the Leibniz Supercomputing Centre, Fraunhofer AISEC, and the Max Planck Institute of Quantum Optics—as well as Infineon Technologies, BMW’s chip design divi-sion, TSMC’s European Design Center, Siemens AG, Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), and the Fraunhofer Institute for Integrated Systems and Device Technology (IISB).
More than 100 researchers from Taiwan and Germany have attended the forum. Participants include distinguished scholars from Taiwan’s top universities along-side leading scientists from premier German universities and world-renowned research institutes. Together, these exceptional teams demonstrate how cross-national and multidisciplinary collaboration can build a highly advantageous co-creation re-search platform. Beyond technical presentations, the forum also features dedicated sessions for research teams from both sides to share their experiences from research stays and life abroad. Industry leaders have also been invited to participate, fostering direct dialogue and stronger connections between academic research and practical industrial application.
During the delegation's visit to the Bavarian State Ministry of Economic Affairs on the 16th of September, Ambassador Dr. Klement Ruey-sheng Gu of the Taipei Representative Office in Germany delivered remarks on behalf of Taiwan, pointing out that Taiwan possesses the world's most complete semiconductor and technology ecosystem, producing over 99% of the world's advanced semiconductor chips and high-end AI server equipment, truly embodying the concept of "No Taiwan, No AI." Furthermore, Ambassador Gu creatively combined the initials of Germany (G) and Taiwan (T) into "GT," imbuing it with the profound meaning of "Get Together"—signifying that as long as the two nations stand united, they will surely create a "Win-Win" prosperity for both their industries and the regional economy.
The NSTC-BMFTR joint research program on semiconductor continuously offers a cross-disciplinary and cross-generational interactive platform, broadening international perspectives for emerging talent and expanding future opportunities for collaboration. Ultimately, by driving industrial innovation through semiconductor technology, we establish a cornerstone for scaling up high-impact international partnerships, further elevating Taiwan’s pivotal role in the global research ecosystem.
Research Contact：
Professor Chen-Yi Lee
Institute of Electronics,
National Yang Ming Chiao Tung University (NYCU)
Tel: +886(6) 5731849
E-mail: cylee@nycu.edu.tw
Media Contact：
Dr. Hui-Chien Cheng
Acting Section Chief
Department of International Cooperation and Science Education
National Science and Technology Council
Tel: +886 (2)2737-7472
