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Taiwan TIE Awards for Israeli Startups/Research Institutions! Apply till May 31!

📢 The TIE Award 2023 Is Now Open For Registration To May 31!   

📢 This year: "Semiconductor Applications" and “Net-Zero Emissions"


🏆 Winners will receive various award benefits, including cash prizes (Highest Prize 30,000 USD) + partial subsidy for business trip and opportunities to partner with Taiwanese semiconductor companies, national-level research institutes.


✴️Registration for 2023 TIE Award👉 /the URL is no longer valid/


✴️Questions? Join Online Briefing Sessions on March 16th, Thursday

Israeli Time: 08:00 - 09:00 AM

👉 /the URL is no longer valid/



Further information:

Annetta  annett@mail.tca.org.tw

Kinki  kinki@mail.tca.org.tw



Last Modified : 2023/11/28