📢 The TIE Award 2023 Is Now Open For Registration To May 31!
📢 This year: "Semiconductor Applications" and “Net-Zero Emissions"
🏆 Winners will receive various award benefits, including cash prizes (Highest Prize 30,000 USD) + partial subsidy for business trip and opportunities to partner with Taiwanese semiconductor companies, national-level research institutes.
✴️Registration for 2023 TIE Award👉 /the URL is no longer valid/
✴️Questions? Join Online Briefing Sessions on March 16th, Thursday
Israeli Time: 08:00 - 09:00 AM
👉 /the URL is no longer valid/
Further information:
Annetta annett@mail.tca.org.tw
Kinki kinki@mail.tca.org.tw
