Tainan Science Park Phase III Groundbreaking Ceremony and Investment Recruitment Event was jointly held by the National Science and Technology Council and Tainan City Government on 29th June, 2023. About 170 distinguished representatives from industries, government, and academia have been invited to participate in this event, witnessing the inception of the development of TSP Phase III. Based on semiconductor industry, TSP Phase III will construct a comprehensive industrial chain and promote smart machinery and precision health industries to benefit other emerging industries through the spillover effect. TSP Phase III will strengthen the growth momentum of the STSP. It is estimated that the introduction of semiconductors, smart machinery, precision health, and other emerging technology industries will provide 4,900 jobs and create an annual turnover of NT$ 39.2 billion, bringing economic prosperity to Tainan district.
Group photo of Vice President Lai(sixth from left), Deputy Mayor of Tainan, Tse-Shan Yeh(fifth from left), Minister of NSTC, Tsung-Tsong Wu(sixth from right), Deputy Minister of Economic Affairs, Wen-Sheng Tseng(fifth from right), Director General of the Construction and Planning Agency, Hsin-Hsou Wu(fourth from right), Director General of STSP Bureau, Jenn-Gang Su(second from right), and several local legislators at the groundbreaking ceremony. (2023/6/29)
