一、關於IC Taiwan Grand Challenge

        由台灣政府跨部會合力推動之晶創臺灣方案(Taiwan Chip-based Industrial Innovation Program，簡稱Taiwan CbI)，為善用台灣半導體高科技產業鏈優勢，以晶片結合生成式AI 等關鍵技術，並以「結合生成式AI+晶片帶動全產業創新」、「強化國內培育環境吸納全球研發人才」、「加速異質整合及先進技術」、「利用矽島實力吸引國際新創與投資來臺」等四大布局，帶動全產業發展。

        其中，為強化台灣全球最大IC新創聚落品牌，吸引全球尖端科技人才及創投資金來台，國家科學及技術委員會舉辦IC Taiwan Grand Challenge，提供在地誘因包括彙整關鍵資源(如晶片下線、光罩、IP服務)、攜手指標半導體企業投資媒合及成立公私合資專屬投資基金，藉此吸引全球潛力晶片應用技術方案新創、學研機構、人才參與徵選，打造台灣成為夢想現實之地。

       為即早發掘潛力團隊、建立與台灣之鏈結，IC Taiwan Grand Challenge於2024年首度舉辦，將鎖定IC設計創新(IC design innovations)與晶片創新應用(Chip-based innovative applications )的全球新創及學研團隊，透過競賽擇優篩選來台設立據點、鏈結國際與民間資金擴散晶片新創應用，以全球最完整的半導體產業生態、快速支援創意實踐。

       台灣政府也期盼藉此獎項，整合在地IC設計、製造、封裝測試到產品流程，以跨國際、跨產學研的徵獎規模，將全球具創新潛力的未來之星匯聚在台，讓人才有發揮空間並實質落地、帶動商機同時驅動相關產業發展。

二、 競賽領域

針對以下領域發展之精進技術或應用解決方案：

第一類：IC設計創新(IC design innovations)：具IC設計自有技術及核心IP，規劃發展創新晶片之學研或新創團隊。

第二類：晶片創新應用(Chip-based innovative applications ) ：具百工百業領域知識(domain knowledge)，規劃結合現有晶片技術實現運用之學研或新創團隊，例如以下主題：Smart Data & Security (資安、量子計算、數位經濟)、Smart Mobility(電動車、自動駕駛、智慧城市)、Smart Manufacturing(智慧製造、IC製程、機器人)、Smart Medtech(生物辨識、智慧監測)、Sustainability(永續製造、節能創新)。

三、 報名資格

(一)  規劃攜手台灣半導體晶片設計、製造産業，共同合作發展創新應用之新創、法人及學研機構、自然人，並符合下列資格均可提出：

1. 須為2016年1月1日之後成立的新創

2. 不得為大陸地區之新創、法人及學研機構、自然人或大陸地區人民、法人團體或其他機構由第三地來臺投資設立之新創

3. 資金來源不得有「大陸地區人民來臺投資許可辦法」第3條第三地公司之資金。(第三地公司指大陸地區人民或法人或機構直接或間接持有該第三地區公司股份或出資總額逾百分之三十；或對該第三地區公司具有控制能力者)

(二)  參賽單位須擁有該產品、技術或解決方案之智慧財產權或已取得合法授權使用。

(三)  參賽單位須於指定時間內提供構想書(初審)及進行簡報(複審)，構想書內容包括技術核心、目前已解決或獲得驗證情形、欲發展之商業模式、市場拓展規劃等。

四、競賽流程

本獎項徵選分為線上競賽及實體競賽2種報名團隊皆可參與不限次數，說明如下：

(一)  線上競賽：

1. 共兩梯次受理報名，第一梯至2024/6/30截止、第二梯2024/9/4-2025/1/31截止，截止後兩週彈性開放團隊補齊申請資料。

2. 線上報名：有意參賽者可隨時線上填寫報名表格並上傳所需提交之資料，包含 IC新創加速平台資源需求申請表(請參考附件一)

線上報名網址 : ictaiwanchallenge.org

3. 資格審查：由主辦單位依據辦法進行資格審查及確認競賽類別。

4. 初審：構想書內容審查，依審查結果後另行通知是否進入複審。

5. 複審：以線上進行報告與問題詢答，簡報者需具備流利英文聽說能力，全程以英文呈現(含簡報及答詢)，時間共計20分鐘。

6. 結果公告：將視送件案件量由主辦單位安排審查時間，並於當次複審結束後兩週通知團隊結果。

(二)  實體競賽：參加主辦單位指定的國際指標展會(例如：Viva Technology 2024、CES 2025)合作之競賽，於展期進行Pitch後公告結果。團隊參賽申請時，需提交IC新創加速平台資源需求申請表(請參考附件一)。

五、評審組成與評分項目

合作競賽場次將陸續公布，各競賽進行方式依該場次規定辦理。

(一)  評審組成：邀請台灣產業、創投、政府部門等領域專家組成委員會，經由初審、複審階段選出獲獎團隊。

(二)  評分項目：

六、獎勵內容

(一)  台灣商務落地鏈結：赴台來回機票及住宿補費用，其補助限用於參加2024或2025台灣創新技術博覽會(TIE)未來科技展，包含展示、頒獎及商務媒合形成，並享有展會虛實整合展出及系列宣傳資源。

(二)  IC新創加速平台產業鏈結及在台晶片發展輔導：協助對接在台期間所需免費EDA工具一年使用、矽智財授權服務(提供免費基礎IP及其他特殊功能IP部分資助)、IC專業設計服務部分資助、光罩晶圓共乘Free Shuttle資助，其他需求彈性額度(如特殊EDA、特殊下線製程、封裝測試等，及在台商務開發)資助，將依實際需求提供所需的投資資助。

(三)  產業專家業師輔導：邀集合作半導體產業企業、資深技術專家、創投等組成業師團對獲選新創提供專業輔導諮詢。

(四)  其他落地資源：給予獲選新創台灣國際新創基地TTA進駐空間 (台北小巨蛋及南部據點，https://www.taiwanarena.tech/)及相關商務開發輔導。專職輔導經理擔任新創與顧問/業師間輔導橋樑，協助新創串接所需資源。

七、 獲獎義務

(一)  團隊參賽申請時需提交附件一申請表單，將依團隊選擇方案提供資源協助，並據以轉換為股權，由行政院國家科學技術發展基金佔股7%-10%。

(二)  獲獎團隊須於公告後三個月內完成投資協議書合約簽訂，並提交「持股證明書」，逾期未交付者須返還所使用輔導資源等值現金。主辦單位保有權利允以延展。合約簽約對象須為公司，若獲選對象為新創或學研團隊，須於簽約前成立公司才可獲得補助。

(三)  獲獎者須來台進行實體鏈結發展，例如於2024年8月31日前通過者，需於2024台灣創新技術博覽會(TIE)實體展示；8月31日後通過者，將於2025台灣創新技術博覽會(TIE)實體展示。

(四)  獲獎者需協助廣宣活動提交相關資料或參與宣傳，並配合主辦單位安排之在台對接行程活動及管考審查等事項。

八、其他注意事項

(一)  參賽標的內容嚴禁抄襲、翻譯、改寫、侵害智慧財產權等違法侵權之情形。主辦單位若發現參賽作品有違反上述事項，得撤銷其參賽資格或得獎之權利，如若造成主辦單位或其他任何第三者之權益損失，違反者應自負法律責任。

(二)  參賽團隊須保證所有填寫或提出之資料均屬事實且正確，且不可冒用任何第三人之資料，如有不實或不正確之事，主辦單位有權取消其參賽資格。

(三)  參賽團隊應尊重評審委員會決定，除能具體證明其他參賽團隊違反本辦法相關規定，對評審結果不得有其他異議。

(四)  主辦單位基於參賽者管理、報名管理、活動期間身分確認、活動聯繫、競賽活動相關訊息聯繫及相關行政作業之目的，得蒐集處理參賽者或其他成員之個人資料。不同意蒐集處理其個人資料者，主辦單位得取消該參賽者入圍或得獎資格。

(五)  根據中華民國所得稅法，本競賽之得獎人獎金須依稅法相關規定預扣繳所得稅。得獎者應提供其身分證明相關文件，供主辦單位報稅使用。

(六)  出於非營利宣傳目的，主辦方有權使用參賽者提供的產品技術訊息，進行出版、著作、公開展示、及發行各類型態媒體宣傳之權利。

(七)  凡報名參加此競賽者，即視為已充分瞭解此規則中各條款，且願意完全遵守本規則所述之各項規定。

(八)  主辦單位保留修改本試行辦法之權利，將滾動修正並即時公布，如有未盡事宜，悉依本會相關規定或解釋辦理。

九、聯絡方式

競賽聯絡窗口：台北市電腦商業同業公會 Annett Wu

聯絡電話: +886 2 25774249 Ext. 312

Email：annett@mail.tca.org.tw

IC新創加速平台聯絡窗口：國科會曾子倩專員

聯絡電話：+886 2 27377136

Email：tctseng2@nstc.gov.tw

I.  Introduction

The Taiwan Chip-based Industrial Innovation Program (Taiwan CbI) is a collaborative effort by various Taiwanese government ministries. It aims to make the most of Taiwan's expertise in semiconductor technology by combining chips with important innovations like generative AI. It focuses on attracting global startups and investment, using generative AI and chips for industry-wide innovation, attracting global talent, and advancing heterogeneous integration for overall industry growth.

To boost Taiwan's position as a leading IC startup cluster, the National Science and Technology Council (NSTC) organizes the IC Taiwan Grand Challenge. It offers local incentives such as chip tape-out, masks, and IP services, collaborates with leading semiconductor companies for investment, and establishes public-private venture capital funds. These efforts aim to attract global talent and investment, with the goal of making Taiwan a hub for innovative chip technologies.

In 2024, the IC Taiwan Grand Challenge will debut, aiming to discover promising teams early and connect them with Taiwan. It will spotlight global startups and academic groups focusing on IC design innovations and Chip-based innovative applications. Top selections will be invited to establish bases in Taiwan, linking them with funding to advance chip innovations, leveraging the world's most comprehensive semiconductor industry ecosystem to support creative endeavors.

The Taiwan government hopes to integrate local IC design, manufacturing, packaging, testing, and product processes through this award. It seeks to attract global talent to Taiwan, driving business opportunities and fostering industry development.

II.  Categories

Advanced technologies or solutions for the following areas of development:

--Category 1 - IC design innovations: Academic research or startup with proprietary IC design technology and core IP, planning and developing innovative chips.

--Category 2 - Chip-based innovative applications: Academic research or startup with domain knowledge in various industries and planning to combine existing chip technologies for implementation, such as the following topics:

*Smart Data & Security (cyber-security, quantum computing, digital economy)

*Smart Mobility (electric vehicles, autonomous driving, smart cities)

*Smart Manufacturing (intelligent manufacturing, IC process, robots)

*Smart Medtech (biometrics, smart monitoring)

*Sustainability (sustainable manufacturing, energy-saving innovation)

III.  Eligibility

1.  Startups, legal entities, academic research institutions and persons that plan to collaborate with Taiwan’s semiconductor chip design and manufacturing industry. Qualified proposals must meet specific criteria.

  (1) Must be a startup set up after January 1, 2016

  (2) It shall not be a startup/legal entity/academic research institution/person from China or a startup established by people, legal entities or other institutions in China from a third place to invest in Taiwan.

  (3) The source of funds shall not include funds from a third-area enterprise, which refers to a person, juristic person or institution in China that directly or indirectly holds more than 30% of the shares or total capital contribution of the third-area enterprise; or having the ability to control the third-area enterprise.

2.  The participant must own the intellectual property rights of the product, technology or solution or have obtained legal licensing access.

3.  The participant must provide concept paper (for initial review) and deliver a presentation (for secondary review) within the designated time. The content of the concept paper includes the core technology, situations that have been solved or verified so far, the business model to be developed, market expansion plans, etc.

IV.  Competition process

The award selection process consists of two types: online and on-site competitions. Teams can participate in both, with no entry limits.

1.  Online competition:

  (1) There are two rounds of registration. The first round ends on June 30, 2024, and the second round runs from September 4, 2024, to January 31, 2025. Teams have a two-week grace period after each deadline to complete their application materials.

  (2) Online registration: Interested participants can fill in the registration form online at any time and upload required documents, including IC Innovation Acceleration Platform Resource Requirement Application Form (please refer to Attachment 1).

Please download the file through IC Taiwan Grand Challenge official website: https://ictaiwanchallenge.org

  (3) Qualification review: The organizer will conduct a qualification review and confirm the competition category in accordance with the regulations.

  (4) Initial review: The content of the concept paper will be reviewed. Based on the review results, candidates will be notified whether to proceed to secondary review.

  (5) Secondary review: The presentation and Q&A will be conducted online. The entire process (including presentation and Q&A) will be conducted in English. The total time is 20 minutes.

  (6) Result Announcement: The organizer will arrange the review schedules based on the amount of applications, and the team will be notified of the results two weeks after the review.

2.  On-site competition:

Participate in competitions for cooperation with international benchmark exhibitions (e.g., Viva Technology 2024, CES 2025) designated by the organizer, and the results will be announced after the pitch is conducted during the exhibition. For the application, it is necessary to submit the IC Innovation Acceleration Platform Resource Requirement Application Form (please refer to Attachment 1).

V.   Judging Criteria

The number of cooperative competitions will be announced respectively. The proceedings of each competition will be handled in accordance with the regulations of the competition, including the composition of the judges and the scoring items.

1.  Jury composition: Experts from Taiwan’s industry, venture capital, government departments in relevant fields are invited to form a committee to select the winning team via initial review and secondary review.

2.  Scoring items (100%):

  (1) Local connectivity (40%)

    i. Have resource needs and specific development plans in Taiwan

    ii. Can provide broader development space for Taiwan’s industry

  (2) Value Creativity (40%)

    i.  Can drive technological innovation potential and create social welfare

    ii. Contribution to promoting new industrial links or promoting industrial upgrading

    iii.The effectiveness of introducing derivative investments or creating high economic value

  (3) Technological innovation (20%)

    i.  Innovation in emerging application fields

    ii. Pioneering in the fields of manufacturing process, design, and application of new materials

    iii.Able to integrate the advantages of diversified innovation and integrated cross-domain thinking

VI.  Awards

1.  Taiwan Business Landing Link: Compensation for round-trip air tickets and accommodation to Taiwan. The subsidy is limited to participating future technology exhibition in the 2024 or 2025 Taiwan Innotech Expo (TIE), including display, awards and business matchmaking, and enjoys the integrated virtual and real exhibitions and series of publicity resources during the TIE.

2.  IC Innovation Acceleration Platform Industry Links and Guidance of Chip Development in Taiwan: Free access of EDA tools for one year while in Taiwan, Silicon Intellectual Property Licensing Services (providing free basic IP and other special function IP with partial subsidies), partial subsidy for IC design services, and IC shuttle. For other requirements for flexible quota (such as special EDA, tape out, packaging, and testing, etc., and business development in Taiwan), the investment subsidy and assistance will be based on actual requirements.

3.  Industry expert mentoring: Invite partner semiconductor industry companies, senior technical experts, venture capital investors, etc. to form an industry mentoring group to provide professional mentorships and consultation to the selected teams.

4.  Other landing resources: Provide the winning team Taiwan International Start-up Base - Taiwan Tech Arena (TTA, https://www.taiwanarena.tech/) with office space (Taipei Arena and southern base) and related business development. The coaching manager serves as a bridge between selected teams and consultants/industry mentors, helping entrepreneurs connect with the necessary resources.

VII.   Obligations

1.  Teams must submit the attached application form when applying to the award. Resource assistance will be provided according to the team's selection plan and converted into equity. The National Science and Technology Development Fund of the Executive Yuan will hold 7%-10% of the shares.

2.  The winning team must complete the signing of the investment agreement and submit the "Shareholding Certificate" within three months after the announcement. Those who fail to deliver within the due date must return cash equivalent to the coaching resources used. The organizer reserves the right to extend the event. The contract signing party must be an eligible company in order to receive the subsidy.

3.  The winners must come to Taiwan for physical link development. For example, those who passed before August 31, 2024 need to physically display at the 2024 TIE; those who pass after August 31 will be displayed at the 2025 TIE.

4.  Winners must assist in publicity activities by submitting relevant information or participating in publicity, and cooperate with the organizer’s arrangements for local itinerary activities and management assessment reviews, etc.

VIII.  Do’s and Don’ts

1.  Plagiarism, translation, rewriting, infringement of intellectual property rights and other illegal infringements are strictly prohibited in the content of the competition. Violation of the above matters may revoke its qualification. If it causes loss of rights and interests of the organizer or any other third party, the violator shall bear legal responsibility.

2.  Participating teams must ensure that all information filled in or submitted is factual and correct, and cannot fraudulently use any third party’s information. If there is any false or incorrect information, the organizer has the right to disqualify the team.

3.  Participating teams shall respect the decision of the review committee and shall not have any other objections to the review results unless they can specifically prove that other participating teams have violated the relevant provisions of these regulations.

4.  The organizer may collect and process personal information of contestants or other members for the purpose of contestant management, registration management, identity confirmation during the event, event contact, competition-related information contact and related administrative operations. For those who do not agree to the collection and processing of their personal information, the organizer may disqualify the contestant from being shortlisted or winning the prize.

5.  According to the Income Tax Law of the Republic of China, the reward to the winner of this competition must withhold income tax in accordance with the relevant provisions of the tax law. Winners should provide their identity documents for tax filing purposes.

6.  For non-profit publicity purposes, the organizer has the right to use the product technical information provided by the contestants to publish, author, publicly display, and distribute various types of media for publicity.

7.  Anyone who registers to participate in this competition is deemed to have fully understood the terms of these rules and is willing to fully abide by the provisions stated in these rules.

8.  The organizer reserves the right to modify these pilot protocol, which will be revised on a rolling basis and announced immediately. If there are any outstanding matters, they will be handled in accordance with the relevant regulations or explanations of NSTC.

IX.    Contact

1. About Competition: Taipei Computer Association

   Contact person: Ms. Annett Wu

   Contact number: +886 2 25774249 Ext. 312

   Email: annett@mail.tca.org.tw

2. About IC Innovation Acceleration Platform: NSTC

   Contact person: Ms. Ziqian Zeng

   Contact number: +886 2 27377136

   Email: tctseng2@nstc.gov.tw