Dear Distinguished Researchers,
Greetings from the editorial office of CMC-Computers, Materials & Continua (2023 SCI IF 2.1, JCR Q3, CiteScore: 5.3, https://www.techscience.com/journal/cmc).
We are currently organizing a special issue on Pattern Recognition and are seeking scholars with outstanding contributions in this field.
We are truly impressed by your achievements in Pattern Recognition research.
CMC Journal would be honored to collaborate with you. We wish you can consider submitting a manuscript to our Special Issue titled " Advancements in Pattern Recognition through Machine Learning: Bridging Innovation and Application " before 31 December 2025.
Submission link: https://www.techscience.com/cmc/special_detail/ml_pattern_recognition
If you would like to proceed with submission, please feel free to reach out to cmc@techscience.com or contact me (linclr@go.hwh.edu.tw) directly to request an APC discount (at least a 20% discount) for future submissions.
Looking forward to your response.
Best regards,
Guest Editor
Prof. Chih-Lung Lin
Hwa-Hsia University of Technology
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(CMC Journal, SCI IF 2.1, CiteScore: 5.3) Call for Papers from Special Issue: Advancements in Pattern Recognition through Machine Learning
相關連結
https://www.techscience.com/cmc/special_detail/ml_pattern_recognition
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